Global Four-Head Laser Drilling Equipment Provider: Tailored Solutions for International Electronics Buyers

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Product Overview

Structure

Laser Drilling Machine

Layout

Vertical

Controlling Mode

Artificial

Number of Shaft

Multi-Axis

Hole Diameter

<50mm

Automatic Grade

Automatic

Precision

High Precision

Certification

CE, RoHS, ISO 9001

Number of Laser Heads

4 Heads

Key Innovation

4-Head Synchronous Technology

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Product Description

Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment - the industry's first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.

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Key Highlights

4-Head Synchronous Processing

Massive 4X Efficiency Boost: Dramatically increase output and meet tight deadlines for large orders.

Optimized Process (Plasma-Free)

Laser parameters are fine-tuned to eliminate post-drilling plasma treatment, reducing process steps.

Picosecond UV Laser Source

Superior Hole Quality: No burrs, cracks, or thermal damage. Perfect for delicate materials.

Precision & Quality Assurance

Our Four-Head Laser Drilling Machine delivers exceptional precision with microscopic accuracy. It demonstrates high-quality drilling results on various materials including PCB, battery separator, and flexible circuit samples. Each hole is perfectly round and uniform.

Efficiency Comparison

4x increase in production capacity
Significant reduction in production time
Lower operational costs per unit
Improved return on investment

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Technical Specifications

Laser Type	Nanosecond UV, Picosecond UV, Picosecond green laser
Processing Area	550mm × 1500mm (customized)
Machine Size	7200mm × 2300mm × 2250mm
Processing Accuracy	±0.02mm
Power Loading	Main Unit +30kW Chiller +7kW Exhaust Fan +11kW
Machine Weight	8000KG
Environment	Humidity: 40% - 60%; Temp: 22℃±2

Company Profile

Founded in 2013, we are a technology-oriented enterprise specializing in independent research and development of laser generators, optical devices, and automated systems. We provide innovative solutions for laser micromachining across industries such as printed circuit boards, consumer electronics, semiconductors, glass, and new energy power batteries.

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Application Areas

PCB Industry: HDI PCBs, Multi-layer Boards, High-speed through-hole drilling.
Flexible Circuits: FPC, Flex-Rigid Boards, Polyimide cutting.
Semiconductor: IC Substrates, Lead Frames, Ultra-fine micro-vias.
Consumer Electronics: Smartphones, Wearables, mass production.

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Packing & Delivery

Packing: 1PCS / Wooden Case

Shipping: By sea or international express. Sea freight is recommended for heavy equipment.

Lead Time: 30-45 days for standard goods; 45-90 days for customized solutions after deposit.

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Our Clients

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Frequently Asked Questions

Q1: What is the main advantage of the 4-head synchronous laser drilling machine? A: It enables parallel processing, quadrupling throughput for HDI PCBs and FPCs while significantly reducing cycle time.

Q2: What is the processing accuracy of the system? A: The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias.

Q3: What materials are compatible with this equipment? A: It is compatible with rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.

Q4: Does the equipment support blind and buried via drilling? A: Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ).

Q5: Is the laser beam quality consistent across all four heads? A: Yes, our beam splitting technology ensures uniform energy distribution across all 4 heads for consistent hole quality.

Q6: What kind of automation features are included? A: The machine features CCD Vision Alignment, automated loading, and real-time distortion correction.